Samsung will use TSMC's 3nm process to produce Nvidia's customized HBM substrate dies

According to a report by Seoul Economic Daily on Sunday, Samsung Electronics will use TSMC's 3nm process to manufacture substrate wafers for NVIDIA's next-generation custom HBM chips. This move will mark Samsung's first collaboration with TSMC in the HBM manufacturing stage. The newspaper, citing industry sources, stated that NVIDIA has requested Samsung, SK hynix, and Micron Technology to use TSMC's process to manufacture NVHBM substrate wafers and apply sixth-generation DRAM technology to produce its core chips. According to the company, the NVHBM, released this August, integrates NVIDIA’s custom memory controller into the substrate and aims to enable standardized implementation across multiple memory suppliers. As reported by Seoul Economic Daily, after internal evaluation, Samsung agreed to NVIDIA’s request but plans to continue using its own production model for standard HBM and customized products for other clients. The newspaper, quoting sources, also noted that Samsung is assessing whether its own foundries can produce NVHBM substrate wafers if demand exceeds TSMC’s capacity.