nVent partners with AMD to add rack-level cooling to Helios AI platform
Bitget2026/10/13 12:02- nVent Electric entered a collaboration with AMD to develop rack-level cooling for AMD’s Helios Rackscale AI platform.
- The partnership adds nVent rear-door heat exchanger cooling to Helios to support high-density AI deployments at scale.
- Companies plan to show an initial look of the open-source solution at the OCP Global Summit in San Jose, Oct. 12-16, 2026.
- nVent’s DC-powered dual rear-door unit targets the double-wide Helios rack to capture residual heat from liquid cooling.
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