Nvidia, Apple, AWS, and MediaTek Compete for TSMC's 2/3nm and CoWoS Production Capacity

As the third quarter progresses, TSMC’s 3nm and 2nm advanced process technology and CoWoS advanced packaging capacity continue to be insufficient to meet demand. According to supply chain sources, Nvidia, Apple, and other companies continue to occupy TSMC’s advanced process and packaging resources. In addition, Amazon AWS has recently increased the production of its self-developed AI chips, with its subsidiary Annapurna acquiring more 3nm capacity. Besides mobile phone chips, MediaTek is also vying for 2nm/3nm process technology and CoWoS-S/L capacity due to large Google TPU-related orders.